1. POLYURETHANE WIRE ENAMEL
VARNISH
|
Product
Test items |
POLYURETHANE |
|
KPU-100-33 |
KPU-200-42 |
KPU-250-35LS |
KPU-300-45 |
KPU-350-35 |
|
Solid contents
(170℃×2Hr) |
32 - 34 |
41 - 43 |
34 – 36 |
44 - 46 |
34 – 36 |
|
Viscosity
(Poise/30℃) |
0.7 - 0.9 |
3.0 - 4.0 |
1.0 - 1.5 |
5 - 8 |
3 - 5 |
|
Applied wire size(mm) |
0.05 - 0.30 |
0.25 - 1.0 |
0.25 - 1.0 |
0.50 - 1.5 |
0.25 - 1.0 |
|
Coating method |
Horizontal
7 times |
Horizontal
6 tiMES |
Horizontal
7 times |
Vertical
6 tiMES |
Horizontal
7 times |
|
Oven temperature ℃ |
360/400 |
360/430 |
360/430 |
360/430 |
360/430 |
|
Enamelling speed
(m/min) |
DV=16
80m |
DV=20
40m |
DV=22
44m |
DV=18
36m |
DV=22
44m |
|
Size |
Bare wire diameter(mm) |
0.2 |
0.5 |
0.5 |
0.5 |
0.5 |
|
outside diameter(mm) |
0.24 |
0.55 |
0.55 |
0.55 |
0.55 |
|
Film thickness(mm) |
0.020 |
0.025 |
0.025 |
0.025 |
0.025 |
|
Phin hole(at per 5m) |
0/3 OK |
0/3 OK |
0/3 OK |
0/3 OK |
0/3 OK |
|
Abrasive resistance(G) |
850G↑ |
850G↑ |
850G↑ |
850G↑ |
850G↑ |
|
Breakdown Voltage (KV) |
5-8 |
6-9 |
5-8 |
5-8 |
6-10 |
|
Cut through Temp
/ Elevated temp. method ℃(2℃/min) |
230-240 |
230-240 |
220-230 |
230-240 |
260-270 |
|
Heat shock
10%enlongation
(150℃×1Hr) |
2d OK |
1d OK |
1d OK |
1d OK |
1d OK |
|
Solvent resistance
(Pencil method) |
4H↑OK |
4H↑OK |
4H↑OK |
4H↑OK |
4H↑OK |
|
Solderability |
380℃×3SEC↓ |
380℃×3SEC↓ |
340℃×2SEC↓ |
380℃×3SEC↓ |
380℃×3SEC↓
400℃×2SEC↓ |
2. POLYESTERIMIDE WIRE ENAMEL
VARNISH
|
Product
Test items |
POLYESTERIMIDE |
SOLDERABLE PEI |
|
H CLASS |
F CLASS |
|
KEI-100-30 |
KEI-200-38 |
KEI-300-40 |
KSEI-350-32H |
KSEI-330-32F |
|
Solid contents
(200℃×2Hr) |
29 - 31 |
37 - 39 |
39 -41 |
31 - 33 |
31 – 33 |
|
Viscosity
(Poise/30℃) |
3 - 5 |
8 - 11 |
12-18 |
3-6 |
3-6 |
|
Applied wire size(mm) |
0.10-0.50 |
0.10-1.0 |
0.25-2.0 |
0.05-0.5 |
0.05-0.5 |
|
Coating method |
Horizontal
7times |
Horizontal.
7times |
Horizontal.
VERTICAL
6-7times |
HORIZONTAL
Vertical
6 tiMES |
HORIZONTAL
VERTICAL
6 TIMES |
|
Oven temperature℃ |
460/540 |
460/540 |
440/520 |
400/450 |
400/450 |
|
Enamelling speed
(m/min) |
DV=20
40M |
DV=12
60M |
DV=20
20M |
DV=11
55M |
DV=10
50M |
|
Size |
Bare wire diameter(mm) |
0.50 |
0.20 |
1.0 |
0.20 |
0.20 |
|
Outside diameter(mm) |
0.55 |
0.256 |
1.068 |
0.254 |
0.254 |
|
Film Thickness(mm) |
0.025 |
0.028 |
0.034 |
0.027 |
0.027 |
|
Abrasive resistance(G) |
1000G↑ |
1000G↑ |
1000G↑ |
1000G↑ |
1000G↑ |
|
Breakdown Voltage (KV) |
8-11 |
9-11 |
8-11 |
8-11 |
8-11 |
|
Cut through temp / Elevated
temp method ℃(2℃/min) |
380 |
380 |
400 |
320 |
310 |
|
Heat shock |
NORMAL STATE (260℃×1HR) |
1D OK |
1D OK |
1D OK |
1D OK |
1D OK |
|
Heat shock
|
20% Enlongation (200℃×30MIN) |
2d OK |
1d OK |
|
2d OK |
3D OK |
|
Solvent resistance
(Pencil method) |
3-4H ↑ |
4H↑ |
3-4H↑ |
3-4H↑ |
3-4H↑ |
|
Freon gas resistance |
- |
- |
- |
- |
|
|
ADHESION PROPERTIES |
- |
- |
GOOD |
- |
|
|
Solderability |
|
|
|
480℃×3SEC↓
450℃×6SEC↓ |
450℃×3SEC↓ |
|
|
|
|
|
|
|
|
3. POLYESTER, POLYAMIDEIMIDE
WIRE ENAMEL VARNISH
|
Product
Test items |
POLYESTER |
POLYAMIDEIMIDE |
| GENERAL |
THEIC
MODIFIED H CLASS |
| KPE-400-40 |
KPE-150-35 |
KPAI-500-30 |
KPAI-500S-27 |
|
Solid contents |
(170℃×2Hr) |
|
|
29-31 |
26-28 |
| (200℃×2Hr) |
39-41 |
34-36 |
|
|
| Viscosity
(Poise/30℃) |
24-25 |
5-10 |
9-13 |
5-10 |
| Applied
wire size(mm) |
0.5-2.0 |
0.1-1.5 |
0.25-3.0 |
0.25-3.0 |
| Oven
temperature ℃ |
450/500 |
450/500 |
470/530 |
470/530 |
| Coating
method |
HORIZONTAL.
VERTICAL6-7 TIMES |
HORIZONTAL
7 TIMES |
HORIZONTAL
6-7 TIMES |
HORIZONTAL
6-7 TIEMS |
| Enamelling
speed
(m/min) |
DV=20
20M |
DV=20
20M |
DV=20
40M |
DV=20
40M |
| Size |
Bare
wire diameter(mm) |
1.0 |
1.0 |
0.50 |
0.50 |
| Outside
diameter(mm) |
1.066 |
1.08 |
0.548 |
0.548 |
| Film
thickness(mm) |
0.033 |
0.04 |
0.024 |
0.024 |
| Abrasive
resistance(G) |
1000G↑ |
1000G↑ |
1200G↑ |
1200G↑ |
| Breakdown
voltage (KV) |
8-11 |
8-11 |
8-11 |
8-11 |
|
Cut through tempErature / Elevated
temp method ℃ (2℃/min) |
320 |
400 |
370
KEI-200 DUAL COAT |
370
KEI-200 DUAL COAT |
|
Heat shock |
0%(280℃×1HR) |
|
|
1D OK |
1D OK |
| nORMAL(240℃×1HR) |
2D OK |
|
|
|
| 20%
ENLONGATION
(200℃×30min) |
|
2D OK |
|
|
| Solvent
resistance
(Pencil method) |
4H |
4H |
6H |
6H |
| Freon
gas resistance |
|
GOOD |
GOOD |
GOOD |
| ADHESION |
GOOD |
GOOD |
|
|
|
|
|
|
|
|
|
|
4. POLYAMIDE, POLY VINYL BUTYRAL,
PHENOXY WIRE ENAMEL VARNISH
|
Product
Test items |
POLYAMIDE |
POLY VINYL BUTYRAL
|
PHENOXY |
| KSB-501-20 |
KSB-530-16 |
KSB-550-21 |
KSB-800-21 |
KSB-600-11 |
KSB-700-20 |
| Solid
contents
(170℃×2Hr) |
19 - 21 |
15 – 17 |
19 – 22 |
19 – 21 |
10 – 12 |
19 - 21 |
| Viscosity
(Poise/30℃) |
25 - 35 |
8 – 10 |
20 – 30 |
20 – 30 |
8 - 10 |
10 - 15 |
| Applied
Wire size(mm) |
0.2 - 0.4 |
0.1 – 0.3 |
0.2 - 0.5 |
0.2 – 0.5 |
0.1 – 0.3 |
0.2 - 0.8 |
| Coating
method |
Horizontal
2-3tiems |
Horizontal
2-3times |
Horizontal
2-3times |
Horizontal
2-3times |
HORIZOMTAL
2-3 TIMES |
Horizontal
2-3times |
| Oven
temperature ℃ |
330 - 380 |
330 – 380 |
330 – 380 |
330 - 380 |
320 - 370 |
330 - 380 |
| Enamelling
speed
(m/min) |
DV=12
60M |
DV=12
60M |
DV=10
50M |
DV=10
50M |
DV=12
60M |
DV=10
50M |
| Size |
Bare wire diameter(mm) |
0.2 |
0.2 |
0.2 |
0.2 |
0.2 |
0.2 |
| Outside diametermm) |
0.27 |
0.27 |
0.27 |
0.27 |
0.26 |
0.26 |
| Film thickness(mm) |
0.035 |
0.035 |
0.035 |
0.035 |
0.03 |
0.03 |
|
|
|
|
|
|
|
|
|
|
※ Heat-resistance propertIES varies by the
classification of the 1st layer,2nd layer is
selected by it's usage. ※ Special products which
are not included above are made by order.
|
